Resistivity and oxygen content of indium tin oxide films deposited at room temperature by pulsed-laser ablation
Identifieur interne : 013D62 ( Main/Repository ); précédent : 013D61; suivant : 013D63Resistivity and oxygen content of indium tin oxide films deposited at room temperature by pulsed-laser ablation
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Abstract
Transparent, conductive indium tin oxide (ITO) films were fabricated by pulsed-laser deposition on substrates held at room temperature. We investigated the relationship between electrical/optical properties of the films and the material stoichiometry, measured by Rutherford backscattering. The lowest resistivity films (∼4×10-4Ωcm) have excessive oxygen compared with the stoichiometric composition ITO. After annealing in argon at 400°C for 1.5 h, the oxygen-to-(indium+tin) ratio approaches the stoichiometric composition of 1.5 and resistivities of annealed samples are ∼2.5×10-4Ωcm. The room-temperature ITO resistivity dependence on chamber gas pressure is explained in terms of a gas-dynamic model and oxygen content of the film. © 1999 American Institute of Physics.
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<front><div type="abstract" xml:lang="en">Transparent, conductive indium tin oxide (ITO) films were fabricated by pulsed-laser deposition on substrates held at room temperature. We investigated the relationship between electrical/optical properties of the films and the material stoichiometry, measured by Rutherford backscattering. The lowest resistivity films (∼4×10<sup>-4</sup>
Ωcm) have excessive oxygen compared with the stoichiometric composition ITO. After annealing in argon at 400°C for 1.5 h, the oxygen-to-(indium+tin) ratio approaches the stoichiometric composition of 1.5 and resistivities of annealed samples are ∼2.5×10<sup>-4</sup>
Ωcm. The room-temperature ITO resistivity dependence on chamber gas pressure is explained in terms of a gas-dynamic model and oxygen content of the film. © 1999 American Institute of Physics.</div>
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